ʻO ka ʻenehana maikaʻi loa kekahi o nā mea hana pcb maikaʻi loa a me nā mea hoʻolako papa kaapuni paʻi ma Kina
ʻLelo
ʻO ka ʻenehana maikaʻi loa kekahi o nā mea hana pcb maikaʻi loa a me nā mea hoʻolako papa kaapuni paʻi ma Kina
ʻO ka BGA (Ball Grid Array) kahi ala i hoʻohana nui ʻia i ka ʻoihana hana uila no ka hoʻopili ʻana i nā kaʻa i hoʻohui ʻia ma luna o nā papa kaapuni paʻi (PCB). Hāʻawi kēia ʻano hana i kahi pilina paʻa a hilinaʻi hoʻi i hoʻohālikelike ʻia me ka ʻenehana ma waena o ka lua a i ʻole ka ʻenehana mauna luna. Eia nō naʻe, ʻo ka paʻakikī o ka soldering BGA e kau i nā pilikia like ʻole i ka wā o ka hana hana. Ma ʻaneʻi, e ʻimi mākou i nā pilikia i kū i ka BGA soldering a kūkākūkā i nā hoʻolālā kūpono e hoʻoponopono ai iā lākou.
He aha ka BGA Soldering?
ʻO ke kūʻai ʻana ʻo BGA kahi ʻenehana e pili ana i ka hoʻopili ʻana i nā pūʻolo kaapuni i hoʻohui ʻia i kahi PCB me ka hoʻohana ʻana i nā pōpō solder. Hana ʻia kēia mau pōpō solder me nā alaleʻa alakaʻi a i ʻole ke alakaʻi ʻole, e pili ana i nā hoʻoponopono kaiapuni a me nā koi kikoʻī. Aia ka pūʻolo BGA i kahi substrate, e hana ana ma ke ʻano he mea lawe no ke kaapuni i hoʻohui ʻia, a me nā pōpō solder e hana i nā pilina uila a me nā mechanical ma waena o ka pūʻolo a me ka PCB.
ʻO ke koʻikoʻi o ka BGA Soldering i ka hana uila
He hana koʻikoʻi ka BGA soldering i ka hana ʻana i nā mea uila like ʻole e like me nā kamepiula, smartphones, a me nā consoles pāʻani. ʻO ka piʻi ʻana o ka noi no nā mea uila liʻiliʻi a ʻoi aku ka ikaika i alakaʻi i ka lawe ʻana i nā pūʻulu BGA. ʻO kā lākou nui paʻa a me ke kiʻekiʻe pin kiʻekiʻe e kūpono iā lākou no nā noi holomua kahi i kaupalena ʻia ka wahi.
ʻO nā pilikia i alo i ka BGA Soldering
l Hoʻolikelike me ka hoʻonoho ʻana
ʻO kekahi o nā paʻakikī nui i ka BGA soldering ʻo ka hōʻoia ʻana i ka alignment ʻāpana kūpono a me ke kau ʻana ma ka PCB. ʻO ka liʻiliʻi liʻiliʻi o nā pōpō solder a me ka hoʻonohonoho paʻa o ka puʻupuʻu BGA e paʻakikī i ka hoʻokō pololei ʻana. ʻO ke kuhi hewa ʻole i ka wā o ka hui ʻana hiki ke hopena i nā alahaka solder, nā pili wehe, a i ʻole ke koʻikoʻi mechanical ma ka pūʻolo.
No ka hoʻoponopono ʻana i kēia pilikia, hoʻohana nā mea hana i nā ʻenehana holomua e like me Automated Optical Inspection (AOI) a me X-ray Inspection. Hoʻohana nā ʻōnaehana AOI i nā kāmela a me nā algorithm hoʻoponopono kiʻi e hōʻoia i ka alignment pololei a me ke kau ʻana o nā ʻāpana BGA. ʻO ka nānā ʻana i ka X-ray, ma ka ʻaoʻao ʻē aʻe, hiki i nā mea hana ke ʻike ma lalo o ka ʻili o ka PCB a ʻike i nā kuhi hewa ʻole a i ʻole nā hemahema i ʻike ʻole ʻia e ka maka.
l Palapala Hoʻopili Solder
ʻO kekahi paʻakikī koʻikoʻi i ka BGA soldering e hoʻokō pololei a paʻa i ka noi solder paste. Solder paste (http://www.bestpcbs.com/blog/2022/08/why-solder-paste-became-dry-and-how-to-solve-this-problem/), kahi hui ʻana o ka solder alloy a me ka flux , hoʻohana ʻia i nā pads PCB ma mua o ka waiho ʻana i ka pūʻolo BGA. Hiki ke alakaʻi i nā pōʻino solder e like me ka lawa ʻole o nā hui solder, nā hakahaka solder, a i ʻole ka solder bridging.
No ka lanakila ʻana i kēia pilikia, pono e nānā pono i ka hoʻolālā stencil a me ke koho ʻana i ka aperture. ʻO nā Stencils me ka mānoanoa kūpono a me nā puka ākea kūpono e hōʻoia i ka waiho ʻana o ka paʻi solder pololei. Hoʻohui, hiki i nā mea hana ke hoʻohana i nā ʻōnaehana Solder Paste Inspection (SPI) e hōʻoia i ka maikaʻi a me ka kūlike o ka solder paste i noi ʻia. ʻO ka paʻi solder i hoʻohana ʻia e Best Technology ʻo SAC305 solder paste.
l Hōʻikeʻike wela
ʻO ka profiling wela, a i ʻole hiki iā mākou ke ʻōlelo i ka hoʻokele wela, he mea koʻikoʻi ia i ka BGA soldering e hōʻoia i ka reflow kūpono o ka solder paste. ʻO ke kaʻina hana hoʻihoʻi e pili ana i ka waiho ʻana i ka PCB i kahi kiʻi wela e mālama pono ʻia, e ʻae i ka hoʻoheheʻe solder e hoʻoheheʻe, hana i kahi hui hilinaʻi, a paʻa. Hiki ke alakaʻi i ka hoʻomaʻamaʻa ʻana i ka wela kūpono ʻole, ka hoʻihoʻi hou ʻole ʻana, a i ʻole ka pōʻino wela i nā ʻāpana.
Pono nā mea hana i ka hoʻonohonoho ʻana i ka umu reflow a me ka calibration e hoʻokō i ka ʻike wela kūpono. ʻO nā ʻenehana hoʻoheheʻe wela, e like me ka hoʻohana ʻana i nā thermocouple a me nā logger data, e kōkua i ka nānā ʻana a me ka mālama ʻana i ka mahana i ka wā o ka reflow.
l Kaʻina Reflow
ʻO ke kaʻina hana reflow ponoʻī e hōʻike i nā luʻi i ka BGA soldering. Pono e hoʻomalu pono ʻia ka ʻāpana soak, ramp rate, a me ka wela kiʻekiʻe no ka pale ʻana i ke koʻikoʻi wela ma nā ʻāpana a hōʻoia i ka hoʻihoʻi hou ʻana o ka solder. ʻO ka hoʻomalu ʻana i ka wela kūpono ʻole a i ʻole ka nui o ka ramp kūpono ʻole hiki ke hopena i nā hemahema solder e like me ka pōhaku kupapaʻu, ka ʻāpana ʻāpana, a i ʻole nā waha i loko o nā hui solder.
Pono nā mea hana e noʻonoʻo i nā koi kikoʻī o ka pūʻulu BGA a hahai i nā profile reflow i manaʻo ʻia i hāʻawi ʻia e nā mea hoʻolako. ʻO ka hoʻoluʻu kūpono ma hope o ka reflow he mea nui hoʻi e pale i ka haʻalulu wela a hōʻoia i ka paʻa o nā hono solder.
l Nānā a me ka mana maikaʻi
ʻO ka nānā ʻana a me ka mālama ʻana i ka maikaʻi he mau mea koʻikoʻi o ka soldering BGA e hōʻoia i ka hilinaʻi a me ka hana o nā hui solder. Hoʻohana mau ʻia nā ʻōnaehana ʻo Automated Optical Inspection (AOI) a me ka nānā ʻana X-ray no ka ʻike ʻana i nā hemahema e like me ke kuhi hewa ʻole, lawa ʻole ka hoʻomaʻemaʻe ʻana i ka solder, solder bridging, a i ʻole nā waha i loko o nā hui solder.
Ma waho aʻe o nā ʻenehana nānā ʻike maka, hiki i kekahi mau mea hana ke hana i ka nānā ʻana i ka ʻāpana ʻāpana, kahi e ʻoki ʻia ai kahi hui solder laʻana a nānā ʻia ma lalo o kahi microscope. Hāʻawi kēia ʻikepili i ka ʻike koʻikoʻi e pili ana i ka maikaʻi o ka hui solder, e like me ka solder wetting, void formation, a i ʻole ka loaʻa ʻana o nā pūhui intermetallic.
Hāʻawi ka BGA soldering i nā pilikia kūʻokoʻa i ka hana uila, pili nui i nā kumu like ʻole. Ma ka hoʻoponopono pono ʻana i kēia mau pilikia, hiki i nā mea hana ke hōʻoia i ka hilinaʻi a me ka hana ʻana o nā hui solder BGA, e hāʻawi ana i ka hana ʻana o nā mea uila kiʻekiʻe.
