E like me ka nui o ka PCBA me FPGA chips no ka mea kūʻai mai ka honua holoʻokoʻa, hiki i ka Best Tech ke hāʻawi aku i ka mea kūʻai mai ka pae hoʻolālā a hiki i ka hopena hoʻokahi me ka polokalamu IC a me ka hoʻāʻo hana hope.
Kuʻi BGA, FPGA populate, QFN Grid Array, FBGA:Fine Ball Grid Array hui,
ʻO Best Tech kahi hale hālāwai ʻike ma Kina, E like me ka hui pū ʻana o ka PCBA me nā chips FPGA no ka mea kūʻai mai ka honua holoʻokoʻa, loaʻa iā Best Tech ka ʻike waiwai e hiki ai ke hāʻawi i ka mea kūʻai mai ka hana hoʻolālā a hiki i nā hopena hoʻokahi me ka polokalamu IC a me ka hoʻāʻo hana hope.
He hana koʻikoʻi loa ka Best Tech i ka hoʻolālā hou o ka mea kūʻai aku, me ka ʻoi aku o 15 mau makahiki waiwai nui i ka hāʻawi ʻana i ka hopena turnkey PCB piha, ʻO ka mea maikaʻi loa i hōʻiliʻili i nā mea kūʻai mai a puni ka honua me kāna mau huahana no Virtual Fronthaul Interface i ka ʻenehana 5G.
Ke ulu wikiwiki nei ka ʻenehana hou 5G i kēia mau makahiki, me ka koi wikiwiki o nā pilina Ethernet, makemake ka poʻe i ka hoʻopili wikiwiki ʻana ma o ka ʻenehana 5G, no laila ke hele mai nei i mea kaulana loa no ka mea ʻoi aku ka wikiwiki a i ka ʻōnaehana palekana lehulehu, pono e loaʻa i nā pūnaewele hilinaʻi. .
Loaʻa i ka Best Tech ka hiki ke kūʻai aku i nā ʻano like ʻole o ka BGA liʻiliʻi a me ka FQN no ka FPGA mai Xilinx kaulana, Texas Instruments, NXP, MPS, Fairchild Semi etc. Ua hoʻokō ʻo Best Tech i ka hui ʻana i ka Small-outline integrated circuit (SOIC)
ʻO ka maikaʻi o ka ʻenehana hoʻopihapiha BGA ma mua o nā ʻenehana hoʻopili ʻē aʻe me nā pine ʻokoʻa (e like me nā pine) ʻo ia ka haʻahaʻa haʻahaʻa haʻahaʻa ma waena o ka pōʻai a me ka PCB. ʻO kēia ka mea e hiki ai i ka wela i hanaʻia e ke kaapuni i hoʻohuiʻia i loko o ka pōʻai e hiki ke maʻalahi i ka PCB, e pale ana i ka puʻupuʻu mai ka wela nui, hiki i nā huahana hope ke hana i ka paʻa a me ka hana maikaʻi.
Ma ka ʻaoʻao ʻē aʻe, pono ka hui BGA e hoʻohana i ka mīkini hui kikoʻī kiʻekiʻe e pale i ke kaapuni pōkole ma lalo o ka pōleʻa BGA no ka mea aia nā pine soldering ma lalo o BGA a inā ʻaʻole hiki ke mālama i ka wā o ke kaʻina hana, e hele mai ia i nā hui solder a me ka ea ma lalo o BGA . Hiki i ka mīkini hui hui ʻo Tech JUKI maikaʻi ke hana i nā pūʻolo kapuaʻi ʻokoʻa no ka BGA a me kā mākou mīkini paʻi paʻi solder paste, nā mīkini hoʻokomo ʻokoʻa kiʻekiʻe, a me 15 mau makahiki o ka ʻike hana ma kēia ʻoihana. Ma hope o ka pau ʻana o ke kūʻai ʻana BGA, e lawe mākou i ka X-RAY e nānā i ke kūlana kūʻai ʻana o ka BGA no ka hōʻoia ʻana ʻaʻohe pilikia kūʻai.
Inā he nīnau kāu no ka BGA/FPGA, ʻaʻole mākaukau e haʻi akā makemake ʻoe i ka ʻike hou aku? E ʻoluʻolu e hoʻokaʻaʻike i ka Best Tech no BGA ma
Nā Papahana PCB | 12L FR4 PCB |
Ka nui o ka ʻāpana PCB | 300mm*339mm |
Mea kumu | ISOLA408HR Tg170 |
PCB mānoanoa | 2.3mm+/-10% |
ʻAno keleawe | 1OZ keleawe i kēlā me kēia papa |
Hoʻopau ʻili | ENIG(Au:8u'',Ni:100-150u'') |
Māka solder | ʻōmaʻomaʻo |
Silkscreen | Keʻokeʻo |
Ua ʻōlelo ʻo Dk& Df | 3.7@2GHz&0.01@10GHz |
ʻO nā mea hoʻohui | ʻĀpono ʻia e like me:Digikey, Mouser& mea hana ʻāpana, hiki ke hoʻokele i nā ʻāpana no ka mea kūʻai aku |
Hōʻoia maikaʻi | E hahai me ka IPC 6012 papa 2&3, nā mea a pau e like me RoHS&UL |
Hōʻoia maikaʻi | Ua hala i ka palapala hōʻoia, ISO9001, ISO13485, ISO16949 |
E waiho wale i kāu leka uila a i ʻole ka helu kelepona ma ka palapala hoʻopili i hiki iā mākou ke hoʻouna aku iā ʻoe i kahi ʻōlelo manuahi no kā mākou ākea ākea!