Best Technology ndi mmodzi wa opanga bwino pcb ndi kusindikizidwa dera bolodi ogulitsa China
Chilankhulo
Best Technology ndi mmodzi wa opanga bwino pcb ndi kusindikizidwa dera bolodi ogulitsa China
BGA (Ball Grid Array) soldering ndi njira yomwe imagwiritsidwa ntchito kwambiri pamakampani opanga zamagetsi pakuyika mabwalo ophatikizika pama board osindikizidwa (PCBs). Njirayi imapereka kulumikizana kocheperako komanso kodalirika poyerekeza ndiukadaulo wamabowo kapena ukadaulo wapamwamba. Komabe, zovuta za BGA soldering zimabweretsa zopinga zosiyanasiyana panthawi yopanga. Apa, tiwona zovuta zomwe zimakumana ndi BGA soldering ndikukambirana njira zabwino zothetsera mavutowo.
Kodi BGA Soldering ndi chiyani?
BGA soldering ndi njira yomwe imaphatikizira kumangiriza mapaketi ophatikizika ozungulira ku PCB pogwiritsa ntchito mipira yambiri yogulitsa. Mipira yogulitsirayi nthawi zambiri imapangidwa ndi ma aloyi opangidwa ndi lead kapena opanda kutsogolera, kutengera malamulo a chilengedwe ndi zofunikira zenizeni. Phukusi la BGA lili ndi gawo lapansi, lomwe limakhala ngati chonyamulira cha dera lophatikizika, ndi mipira ya solder yomwe imapanga kulumikizana kwamagetsi ndi makina pakati pa phukusi ndi PCB.
Kufunika kwa BGA Soldering mu Electronics Manufacturing
BGA soldering imagwira ntchito yofunika kwambiri popanga zida zosiyanasiyana zamagetsi monga makompyuta, mafoni a m'manja, ndi masewera a masewera. Kuwonjezeka kwakufunika kwamagetsi ang'onoang'ono komanso amphamvu kwambiri kwachititsa kukhazikitsidwa kwa phukusi la BGA. Kukula kwawo kophatikizika ndi kachulukidwe kakang'ono ka pini kumawapangitsa kukhala oyenera ku mapulogalamu apamwamba pomwe malo ali ochepa.
Zovuta Zomwe Mukukumana nazo mu BGA Soldering
l Kuyanjanitsa Kwagawo ndi Kuyika
Chimodzi mwazovuta zazikulu mu BGA soldering ndikuwonetsetsa kulondola kwa zigawo ndikuyika pa PCB. Kukula kwakung'ono kwa mipira yogulitsira ndi mawonekedwe okhuthala a phukusi la BGA kumapangitsa kuti zikhale zovuta kukwaniritsa malo enieni. Kusalongosoka panthawi ya msonkhano kungayambitse milatho ya solder, kugwirizana kotseguka, kapena kupanikizika kwa makina pa phukusi.
Pofuna kuthana ndi vutoli, opanga amagwiritsa ntchito njira zamakono monga Automated Optical Inspection (AOI) ndi X-ray Inspection. Makina a AOI amagwiritsa ntchito makamera ndi ma aligorivimu okonza zithunzi kuti atsimikizire kulondola kolondola ndi kuyika kwa zigawo za BGA. Kuwunika kwa X-ray, kumbali ina, kumalola opanga kuwona pansi pa PCB ndikuwona zolakwika zilizonse kapena zolakwika zomwe sizingawonekere ndi maso.
l Pulogalamu ya Solder Paste
Vuto lina lalikulu mu BGA soldering ndikukwaniritsa ntchito yolondola komanso yosasinthika ya solder phala. Phala la solder (http://www.bestpcbs.com/blog/2022/08/why-solder-paste-became-dry-and-how-to-solve-this-problem/) , chisakanizo cha solder alloy ndi flux , umagwiritsidwa ntchito pa ziyangoyango PCB pamaso kuyika phukusi BGA. Kusakwanira kapena kuchulukirachulukira kwa solder kungayambitse zolakwika za solder monga ma solder osakwanira, ma solder voids, kapena solder bridging.
Kuti muthane ndi vutoli, ndikofunikira kuyang'anitsitsa kapangidwe ka stencil ndi kusankha kabowo. Ma stencil okhala ndi makulidwe oyenera komanso ma apertures owoneka bwino amatsimikizira kuyika kolondola kwa solder. Kuphatikiza apo, opanga amatha kugwiritsa ntchito makina a Solder Paste Inspection (SPI) kuti atsimikizire mtundu ndi kusasinthika kwa phala la solder lomwe lagwiritsidwa ntchito. Phala la solder lomwe Best Technology limagwiritsa ntchito ndi SAC305 solder phala.
l Kutentha Kwambiri
Kutentha kwambiri, kapena tinganene kasamalidwe ka matenthedwe, ndikofunikira mu BGA soldering kuti mutsimikizire kuyenderera koyenera kwa solder phala. Kubwezeretsanso kumaphatikizapo kuyika PCB ku mbiri ya kutentha yoyendetsedwa bwino, kulola kuti phala la solder lisungunuke, lipange mgwirizano wodalirika, ndi kulimbitsa. Kusakwanira kwa kutentha kungayambitse kunyowetsa solder kosakwanira, kusefukira kosakwanira, kapena kuwonongeka kwa kutentha kwa zigawo zikuluzikulu.
Opanga akuyenera kukhathamiritsa khwekhwe la uvuni wa reflow ndi kusanja kuti akwaniritse kutentha koyenera. Njira zowonetsera kutentha, monga kugwiritsa ntchito ma thermocouples ndi odula deta, zimathandiza kuyang'anira ndi kuwongolera kutentha panthawi yobwezeretsanso.
l Reflow Njira
Njira yobwezeretsanso imabweretsa zovuta mu BGA soldering. Malo onyowa, mitengo yokwera, komanso kutentha kwapamwamba kuyenera kuyang'aniridwa mosamala kuti tipewe kupsinjika kwamafuta pazinthuzo ndikuwonetsetsa kuti solder ikuyenda bwino. Kusakwanira kowongolera kutentha kapena ma ramp osayenera kungayambitse zolakwika za solder monga tombstoneng, component warpage, kapena voids muzitsulo za solder.
Opanga akuyenera kuganizira zofunikira za phukusi la BGA ndikutsatira zomwe amalimbikitsa kuti abwererenso zomwe zimaperekedwa ndi othandizira zigawo. Kuziziritsa koyenera pambuyo pa kubwezeretsanso ndikofunikira kuti tipewe kugwedezeka kwa kutentha ndikuwonetsetsa kukhazikika kwa zida za solder.
l Kuyang'anira ndi Kuwongolera Ubwino
Kuyang'anira ndi kuyang'anira khalidwe ndizofunika kwambiri za BGA soldering kuti zitsimikizire kudalirika ndi ntchito zazitsulo zogulitsira. Makina a Automated Optical Inspection (AOI) ndi kuunika kwa X-ray nthawi zambiri amagwiritsidwa ntchito kuti azindikire zolakwika monga kusalolera bwino, kunyowetsa kosakwanira kwa solder, bridging ya solder, kapena voids m'malo olumikizirana.
Kuphatikiza pa njira zowunikira zowonera, opanga ena amatha kusanthula magawo osiyanasiyana, pomwe cholumikizira chachitsanzo chimadulidwa ndikuwunikidwa pa microscope. Kusanthula uku kumapereka chidziwitso chamtengo wapatali chokhudza mtundu wa solder, monga kunyowetsa solder, kupanga void, kapena kupezeka kwa intermetallic compounds.
BGA soldering imapereka zovuta zapadera pakupanga zamagetsi, makamaka zokhudzana ndi zinthu zosiyanasiyana. Pothana ndi zovutazi moyenera, opanga amatha kutsimikizira kudalirika ndi magwiridwe antchito a BGA solder joints, zomwe zimathandizira kupanga zida zapamwamba zamagetsi.
