Chigawo chosindikizidwa cha mbali imodzi (1-layer flex circuit) ndimwambo wosinthika pcb ndi wosanjikiza umodzi wa mkuwa kufufuza pa gawo lapansi limodzi, ndi wosanjikiza umodzi wa Polyimide zokutira laminated kuti kufufuza mkuwa kuti mbali imodzi yokha yamkuwa adzakhala poyera, kotero kuti amangolola kupeza mkuwa kufufuza kuchokera mbali imodzi, poyerekeza ndi wapawiri mwayi flex dera. zomwe zimalola kupeza kuchokera pamwamba ndi pansi pa flex circuit. Popeza pali mzere umodzi wokha wamkuwa, umatchedwanso 1 wosanjikiza wosindikiza wosinthika, 1-wosanjikiza flexible circuit, kapena 1-wosanjikiza FPC, kapena 1L FPC.
Mbali ziwirimakonda flex mabwalo imakhala ndi ma conductor amkuwa a mbali ziwiri ndipo imatha kulumikizidwa mbali zonse ziwiri. Zimalola mapangidwe ozungulira ovuta kwambiri, ndi zigawo zambiri zomwe zimasonkhanitsidwa. Zinthu zazikulu zomwe zimagwiritsidwa ntchito ndi zojambula zamkuwa, polyimide ndi zokutira. Adhesiveness stack-up ndi yotchuka chifukwa chokhazikika bwino, kutentha kwambiri, komanso makulidwe owonda.
Dongosolo loyendera maulendo apawiri limatanthawuza ma flex circuit omwe amatha kupezeka kuchokera pamwamba ndi pansi koma amangokhala ndi mzere wotsatira wa conductor. Makulidwe a mkuwa 1OZ ndi zokutira 1mil, ndizofanana ndi 1 wosanjikiza FPC ndi mbali ina FFC. Pali mipata yotchinga mbali zonse ziwiri za flex circuit kotero kuti pali PAD yogulitsidwa kumbali zonse za pamwamba ndi pansi, zomwe ziri zofanana ndi FPC ya mbali ziwiri, koma mbali ziwiri zolowera flex board zimakhala ndi stack yosiyana chifukwa cha mkuwa umodzi wokha. , kotero palibe plating yomwe ikufunika kuti ipangike pobowo (PTH) kuti ilumikizane pakati pa pamwamba ndi pansi, ndikutsata masanjidwe ndikosavuta.
Mipikisano wosanjikiza makonda flex flex circuit imatanthawuza kusinthasintha kozungulira komwe kumakhala ndi magawo awiri ozungulira. Zitatu kapena kuposa kusinthasintha conductive zigawo ndi kusintha kutsekereza zigawo pakati pa aliyense, amene interconnected mwa njira ya dzenje metallized kudzera vias / mabowo ndi plating kupanga njira conductive pakati pa zigawo zosiyanasiyana, ndi kunja ndi polyimide insulating zigawo.