Best Technology ndi mmodzi wa opanga bwino pcb ndi kusindikizidwa dera bolodi ogulitsa China
Chilankhulo
Best Technology ndi mmodzi wa opanga bwino pcb ndi kusindikizidwa dera bolodi ogulitsa China
BGA, dzina lake lonse ndi Ball Grid Array, yomwe ndi mitundu ya njira zopakira momwe mabwalo ophatikizika amagwiritsa ntchito matabwa onyamula organic.
Ma board a PCB okhala ndi BGA ali ndi zikhomo zambiri zolumikizirana kuposa ma PCB wamba. Mfundo iliyonse pa bolodi BGA akhoza soldered paokha. Malumikizidwe onse a ma PCB awa amwazikana ngati mawonekedwe a matrix ofananira kapena gululi pamwamba. Mapangidwe a ma PCB awa amalola kuti pansi panse pakhale kugwiritsidwa ntchito mosavuta m'malo mongogwiritsa ntchito zotumphukira.
Zikhomo za phukusi la BGA ndi zazifupi kwambiri kuposa PCB wamba chifukwa ili ndi mawonekedwe amtundu wozungulira. Pachifukwa ichi, imatha kupereka magwiridwe antchito bwino pama liwiro apamwamba. Kuwotcherera kwa BGA kumafuna kuwongolera bwino ndipo nthawi zambiri kumayendetsedwa ndi makina odziwikiratu.
We akhoza solder ndi PCB ndi yaing'ono kwambiri BGA kukula ngakhale mtunda pakati pa mpira ndi 0.1mm okha.
