Through-hole PCB Assembly is to use reflow soldering technology to assemble through-hole components and special-shaped components.
As nowadays products pay more and more attention to miniaturization, increased functionality, and increased component density, many single-sided and double-sided panels are mainly surface-mounted components.
The key to using through-hole devices on circuit boards with surface-mounted components is the ability to provide simultaneous reflow soldering for through-hole and surface-mount components in a single integrated process.
Compared with the general surface mount process, the amount of solder paste used in the through-hole reflow process is more than that of the general SMT, which is about 30 times. Currently, the through-hole reflow process mainly uses two solder paste coating technologies, including solder paste printing and automatic solder paste dispensing.