Through-hole PCB Assembly is to use reflow soldering technology to assemble through-hole components and special-shaped components.

As nowadays products pay more and more attention to miniaturization, increased functionality, and increased component density, many single-sided and double-sided panels are mainly surface-mounted components.

 

The key to using through-hole devices on circuit boards with surface-mounted components is the ability to provide simultaneous reflow soldering for through-hole and surface-mount components in a single integrated process.

 

Compared with the general surface mount process, the amount of solder paste used in the through-hole reflow process is more than that of the general SMT, which is about 30 times. Currently, the through-hole reflow process mainly uses two solder paste coating technologies, including solder paste printing and automatic solder paste dispensing.


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