Through hole PCB assembly is to use reflow soldering technology to assemble through-hole components and special-shaped components. As nowadays products pay more and more attention to miniaturization, increased functionality and increased component density, many single-sided and double-sided panels are mainly surface-mounted components.
The key to using through-hole devices on circuit boards with surface-mounted components is the ability to provide simultaneous reflow soldering for through-hole and surface-mount components in a single integrated process.
Compared with the general surface mount process, the amount of solder paste used in the PCB through hole assembly is more than that of the general SMT, which is about 30 times. Currently, the through hole PCB assembly mainly uses two solder paste coating technologies, including solder paste printing and automatic solder paste dispensing.