BGA, its full name is Ball Grid Array, which is kinds of packaging method in which integrated circuits use organic carrier boards.  

 

The PCB boards with BGA have more interconnect pins than ordinary PCBs. Each point on the BGA board can be soldered independently. The entire connections of these PCBs are scattered in the form of a uniform matrix or surface grid. The design of these PCBs allows the entire bottom surface to be easily used instead of just using the peripheral area.

 

The pins of the BGA package are much shorter than the ordinary PCB because it has only a perimeter type shape. For this reason, it can provide better performance at higher speeds. BGA welding requires precise control and is more often guided by automatic machines.

 

We can solder the PCB with very small BGA size even the distance between the ball is only 0.1mm. 


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    Professional multi-layer PCB manufacturer and assembly from China. We can support to solder different BGA on the PCB board by our rich experience and advanced devices.BGA soldering, BGA assembly, Ball Grid Array.
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    Best Tech is an experienced Mechanical assembly house in China since 2006. Best Tech is capability to managed to support to different Mechanical assembly on the difference kinds of products.Mechanical assembly, Mechanical populate, Mechanical fitted.
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    Medical PCBA have become critically important in the medical device. As technology has advanced, more and more medical diagnostic, research and treatment methods have become computerized, which means PCBA for medical equipment are becoming a standard requirement throughout the industry. BGA soldering, BGA welding, BGA assembly for medical productsBest Tech is an experienced assembly house in China, As assembled lots of PCBA with FPGA chips for customer from all over the world, Best Tech have rich experience whom could provide customer from design phase to one stop solutions with IC programming and final function testing.
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