High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 o="">300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
According to layer up different, currently DHI board is divided into three basic types:
1) HDI PCB (1+N+1)
Features:
Suitable for BGA with lower I/O counts
Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
Qualified material and surface treatment for Lead-free process
Excellent mounting stability and reliability
Copper filled via
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card
2) HDI PCB (2+N+2)
Features:
Suitable for BGA with smaller ball pitch and higher I/O counts
Increase routing density in complicated design
Thin board capabilities
Lower Dk / Df material enables better signal transmission performance
Copper filled via
Application: Cell phone, PDA, UMPC, Portable game console, DSC, Camcorder
3) ELIC (Every Layer Interconnection)
Features:
Every layer via structure maximizes design freedom
Copper filled via provides better reliability
Superior electrical characteristics
Cu bump and metal paste technologies for very thin board
Application: Cell phone, UMPC, MP3, PMP, GPS, Memory card.