Active Metal Brazing (AMB) process is a further development of DBC technology. It uses a small amount of active elements such as Ti, Zr, Cr in the filler metal to react with the ceramic to form a reaction layer that can be wetted by the liquid filler metal, so as to bond the ceramic substrate with metal layer. AMB substrate is based on the chemical reaction of ceramic and active metal at high temperature to achieve the combination, so it has higher bonding strength and better reliability. The active metal layer also provides a metallization layer for the ceramic substrate, which can significantly reduce the processing time and cost of the PCB.
Features of Active Metal Braze Ceramic PCB
Higher thermal conductivity
The thermal conductivity of ceramic substrates is much higher than that of traditional organic substrates, which makes AMB ceramic PCBs suitable for high-power applications that require efficient heat dissipation.
Higher bonding strength
Due to the AMB ceramic PCB is based on the reaction of ceramic and active elements at high temperature, which makes it has higher bonding strength than other types of ceramics.
The active metal brazing process forms a strong and stable bond between the ceramic substrate and the metal layers, which can significantly improve the reliability of the PCB.
Excellent electrical properties
Ceramic substrates have low dielectric constant and loss, which can minimize signal loss and interference in high-frequency applications.
The active metal layer provides a metallization layer for the ceramic substrate, which can reduce the processing time and cost of the PCB. (But in anther way, the AMB manufacturing needs an expensive equipment.)
Not everything is perfect, AMB ceramic also has its drawbacks.
Brittle/fragile: Ceramic substrates are more brittle than traditional organic substrates, which
may increase the risk of cracking or breaking during manufacturing or assembly, so be carefully when assemble or in transition.
Limited flexibility: Ceramic substrates have limited flexibility, which may limit the design
options of the PCB.
Applications of Active Metal Braze Ceramic PCB
AMB ceramic PCBs are widely used in high-power and high-reliability applications, such as power electronics, aerospace, and military applications. In power electronics, AMB ceramic PCBs are generally used in high-power inverters, motor drives, and power supplies, where high thermal conductivity and reliability are essential. In aerospace and military applications, AMB ceramic PCBs are used in avionics, radars, and communication systems, where high reliability and harsh environment resistance are required.
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