We know, the proper BGA soldering is a key point in the SMT process, to better understanding and soldering the BGA, knowing its challenges and difficulties are important. Here is the major challenge of BGA soldering - thermal management
The Ball Grid Array (BGA) is an advanced packaging technology widely used in the electronics industry. It has revolutionized the way integrated circuits (ICs) are mounted onto printed circuit boards (PCBs). BGA offers numerous benefits over traditional packaging methods, making it a popular choice for high-performance and compact electronic devices.
Due to the BGA packages have a high pin density and often contain power-hungry components, resulting in significant heat generation. Efficient dissipation of this heat is crucial to prevent overheating and ensure the longevity and performance of the electronic device. The dense arrangement of solder balls and the limited space between them make it challenging to effectively dissipate heat.
So design a proper thermal management for your BGA chips is obvious important.
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