As manufactured lots of PCBA with FPGA chips for customer from all over the world, Best Tech can provide customer from design phase to one stop solutions with IC programming and final function testing.
BGA soldering, FPGA populate, QFN Grid Array, FBGA：Fine Ball Grid Array assembly,
Best Tech is an experienced assembly house in China, As assembled lots of PCBA with FPGA chips for customer from all over the world, Best Tech have rich experience whom could provide customer from design phase to one stop solutions with IC programming and final function testing.
Best Tech plays a very important role in customer new design, with more than 15 years rich experience in provide the complete PCB turnkey solution, Best accumulated many customers from all over the world with its products for Virtual Fronthaul Interface in 5G technology.
5G new technology growing up rapidly these years, with the fast demand of Ethernet interfaces, people want more quickly connection via 5G technology, so it come to more and more popular because faster and in the most Public Safety system, it required have more reliability networks.
Best Tech have the ability to soldering different kinds of small BGA and FQN for the FPGA from famous Xilinx, Texas Instruments, NXP, MPS, Fairchild Semi etc. Best Tech managed to assembly Small-outline integrated circuit (SOIC)
The advantage of BGA packaging technology over other packaging technologies with separate pins (such as pins) is the low thermal impedance between the package and the PCB. This allows the heat generated by the integrated circuit in the package to be more easily transmitted to the PCB, preventing the chip from overheating, the final products can work it stable and good performance.
In other side, the BGA assembly it needs to use high precision assembly machine to avoid short circuit under BGA ball because the soldering pins are under BGA and if cannot take care during the assembly process, it will come to solder joints and air bubble under BGA. Best Tech JUKI assembly machine can make different footprint package for BGA and our automatic printing solder paste equipment, advanced automatic placement machines, and 15 years of work experience in this industry. After the BGA soldering is completed, we will take X-RAY to examine the soldering situation of the BGA to ensure that there is no soldering issue.
If you have some question for the BGA/FPGA, not ready to quote but want more info? Please feel free to contact Best Tech for BGA in
|PCB Layers||12L FR4 PCB|
|PCB unit size||300mm*339mm|
|Base material||ISOLA408HR Tg170|
|Copper Type||1OZ copper in each layer|
|Components sourcing||Authorized agent like:Digikey,Mouser& components manufacturer,capabilities with components management for customer|
Follow with IPC 6012 class 2&3, all material conforms to RoHS&UL
|Quality Assurance||Passed the qualified certification, ISO9001, ISO13485, ISO16949|
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