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Best Tech plays a very important role in customer new design, with more than 15 years rich experience in provide the complete PCB turnkey solution, Best accumulated many customers from all over the world with its products for Virtual Fronthaul Interface in 5G technology.

5G new technology growing up rapidly these years, with the fast demand of Ethernet interfaces, people want more quickly connection via 5G technology, so it come to more and more popular because faster and in the most Public Safety system, it required have more reliability networks.

Best Tech have the ability to soldering different kinds of small BGA and FQN for the FPGA from famous Xilinx, Texas Instruments, NXP, MPS, Fairchild Semi etc. Best Tech managed to assembly Small-outline integrated circuit (SOIC)

The advantage of BGA packaging technology over other packaging technologies with separate pins (such as pins) is the low thermal impedance between the package and the PCB.  This allows the heat generated by the integrated circuit in the package to be more easily transmitted to the PCB, preventing the chip from overheating, the final products can work it stable and good performance.

In other side, the BGA assembly it needs to use high precision assembly machine to avoid short circuit under BGA ball because the soldering pins are under BGA and if cannot take care during the assembly process, it will come to solder joints and air bubble under BGA. Best Tech JUKI assembly machine can make different footprint package for BGA and our automatic printing solder paste equipment, advanced automatic placement machines, and 15 years of work experience in this industry. After the BGA soldering is completed, we will take X-RAY to examine the soldering situation of the BGA to ensure that there is no soldering issue.

If you have some question for the BGA/FPGA, not ready to quote but want more info? Please feel free to contact Best Tech for BGA in

PCB Layers12L FR4 PCB
PCB unit size300mm*339mm
Base materialISOLA408HR Tg170
PCB thickness2.3mm+/-10%
Copper Type1OZ copper in each layer
Surface finishingENIG(Au:8u'',Ni:100-150u'')
Solder maskGreen
SilkscreenWhite
Dk& Df3.7@2GHz&0.01@10GHz
Components sourcingAuthorized agent like:Digikey,Mouser& components manufacturer,capabilities with components management for customer
Quality Assurance

Follow with IPC 6012 class 2&3, all material conforms to RoHS&UL

Quality AssurancePassed the qualified certification, ISO9001, ISO13485, ISO16949


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They are all manufactured according to the strictest international standards. Our products have received favor from both domestic and foreign markets.
They are now widely exporting to 200 countries.
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