Professional multi-layer PCB manufacturer and assembly from China. We can support to solder different BGA on the PCB board by our rich experience and advanced devices.
BGA soldering, BGA assembly, Ball Grid Array.
We can produce the PCB that the customer wants and able to assemble different kinds of components according to the customer's design.
After finishing the PCBA, this 6-layer PCB with differential impedance is used for drones. As we know, drones are very popular because of their compactness, intelligence, remote control, and convenience for taking photos and videos.
These advantages place relatively high requirements on the PCBA used by drones: small size and large memory. Compared with traditional IC chips, BGA is a good choice. The full name of BGA is Ball Grid Array, which has a smaller size, better heat dissipation performance and electrical performance.
Due to the packaging characteristics of BGA, the soldered pins are circular or cylindrical solder joints distributed under the package in an array form. During the placement process, there are requirements for the amount of solder paste, assembling machines, and soldering experience, as well as welding inspection. If the soldering is improper, it is very easy to cause a short circuit.
We have fully automatic printing solder paste equipment, advanced automatic placement machines, and 15 years of work experience in this industry. After the BGA soldering is completed, we will take X-RAY to examine the soldering situation of the BGA to ensure that there is no soldering issue.
If you have similar demand of BGA assemble, please feel free to contact us!
|PCB Layers:||6 layers|
|PCB unit size:||38mm*106mm|
|Base material:||FR4 Tg170|
|Surface finishing:||ENIG (Au 1u’’)|
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