Professional FPC factory, can manufacture 3 layers HDI FPC, with blind holes, add FR4 and stainless steel stiffener.
HID FPC, FPC with Blind holes.
What’s the difference between Blind holes, and Buried holes?
Blind Via Hole: Connects the outermost circuit of PCB with the adjacent inner layer by electroplating Hole. Because you can't see the opposite side, it is called Blind.
Drill the holes in the individual circuit layer, where layers need connect. And then glue it together.
It need more precise positioning and contraption device.
Buried hole: PCB internal connection of any circuit layer but not conductive to the outer layer. This process cannot be achieved by drilling after bonding. Drilling must be performed at the time of individual circuit layers, and the inner layers must be partially bonded and then electroplated before they can be fully bonded. This process is usually used only at high density (HDI) to increase available space for other circuit layers.
1mil adhesiveless Polyimide(PI)
Board Total Thickness
1/2 mil coverlay
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