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What’s the advantages of ENEPIG?

1. The gold coating is very thin and can play gold wire, also can play aluminum wire.

2. Palladium layer Palladium nickel layer separated from the gold layer, can also prevent the mutual migration between gold and nickel, will not appear black nickel phenomenon.

3. Improved weldability after high temperature aging and high humidity, excellent weldability, high temperature aging weldability is also very good.  

4. The cost is very low, gold thickness is 0.03-0.04um, palladium thickness is about 0.025-0.03um on average.

5. The palladium layer is thin and uniform.

6. The nickel layer is lead-free.

7. The coating has good compatibility with the solder paste.  

Description

Specification

Construction

2L FPC

Base Material

1mil adhesiveless Polyimide(PI)

Cu Type

1OZ

Board Total Thickness

0.23mm+/-0.03mm

Coverlay

1 mil coverlay

Surface Treatment

ENIG(Au 1u'')

Silk screen

 With blind holes



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