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VR

As soon as BGA became the best choice for high density, high performance, multi-function and high I / O pin packaging for VLSI chips such as CPU and North-South Bridge.Its characteristics are:

1.Although the number of I / O pins is increased, the pin spacing is much larger than QFP, thus improving the assembly yield;

2. Although its power consumption increases, BGA can be welded by the controllable collapse chip method, or C4 welding, which can improve its electric thermal performance;

3. The thickness is more than 1 / 2 less than QFP, and the weight is reduced by more than 3 / 4;

4. Parasite parameters are reduced, the signal transmission delay is small, and the use frequency is greatly improved;

5. Assembly can be used in common planar welding, with high reliability;

6.BGA packaging is still the same as QFP, PGA, occupying the substrate area is too large;

DescriptionSpecification
PCB Layers6L FR4 PCB
Base materialTg160
PCB thickness4.5mm+/-10%
Copper Type9`OZ copper in each layer
Surface finishingENIG
Technology

Ball Grid Array Package

GreenSolder mask
SilkscreenWhite


  




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