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VR

Traditional PCB designers usually share the current by adding repeated layers to add 3 to 4 o z copper, in parallel and cross.In practice, without fully distributing the current evenly, some layers will carry more current, generating greater losses, and the circuit boards will generate more heat than when designed.The use of super-thick copper PCB, thickened overholes, and plug-in holes can eliminate the need for parallel layers, thus eliminating the load imbalance in multilayer parallel connection.The temperature rise generated by the loss can be even more accurately estimated.The thick copper passing through the hole and the hole wall of the plug-in can greatly reduce the failure caused by thermal stress, resulting in a lower temperature and more reliable PCB.

Description

Specification

PCB Layers

14L FR4 PCB

Base material

 Tg170

PCB thickness

4.0mm+/-10%

Copper Type

5OZ copper in each layer

Surface finishing

ENIG

Solder mask

Matte black solder mask

Silkscreen

N/A




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