Thick film circuit board, also known as a hybrid circuit board, is formed by screen printing on the substrate of different materials. The substrate is mainly 96% alumina ceramic materials.
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850℃ Sintering.Screen printing technology was used to coat the ceramic substrate and prepared after drying and high temperature sintering.Metal slurry Generally by metal powder, organic resin and glass and other components.After high temperature sintering, the resin adhesive is burned off, and the rest is almost all pure metal. Due to the glass mass bonding action on the ceramic substrate surface.The sintered metal layer thickness is 10 to 20 m and a minimum line width of 0.3mm.
Material | BeO |
Board Thickness | 1.5mm+/-10% |
Conductor | 10um AgPd+ 2-5um Au |
Glass Glaze | Green |
Silkscreen | N/A |
Application | Laser Product |
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