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Basic Parameter of DBC Ceramic Printed Circuit Board
· DBC (Direct Bonded Copper) technology denotes a special process in which the copper foil and the Al2O3 or AlN (one or both sides) are directly bonded under appropriate high temperature.
· The substrate thickness can be 0.25mm, 0.38mm, 0.5mm, 0.635mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm etc.
· The conductor is copper, and thickness of conductor can be half OZ to 10OZ
· Min trace width and space for volume production: 0.12mm & 0.12mm, 0.10mm/0.10mm is also okay but cost will be higher, and 0.10mm/0.10mm only available for prototype.
· Tolerance for final trace layout will be +/-10%
· Suitable for wire bonding.
· Normally layers are 1L and 2L (with plated through hole (PTH), and plated material is the same like the one used for conductor), and maximum layers is 2L
· Only board with Rectangle shape can be shipped via single piece, or via panel
· Soldermask is also available upon request.
· DPC ceramic PCB can conduct the heat away very fast and keep the working temperature stable, thick film ceramic PCB is very good for all product that need good thermal conductivity.
· High mechanical strength, mechanically stable shapes. Hight strength, fine thermal conductivity, excellent electrical isolation. Good adhesion, corrosion resistant;
· Excellent thermal cycling capabilities (up to 50,000 cycles), high reliability;
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