Best Technology ndeimwe yakanakisisa pcb vagadziri uye akadhindwa redunhu bhodhi vatengesi mu China
Mutauro
Best Technology ndeimwe yakanakisisa pcb vagadziri uye akadhindwa redunhu bhodhi vatengesi mu China
BGA (Ball Grid Array) solder inzira inoshandiswa zvakanyanya muindasitiri yekugadzira zvemagetsi yekuisa masekete akabatanidzwa pamabhodhi edunhu akadhindwa (PCBs). Iyi nzira inopa yakawedzera compact uye yakavimbika yekubatanidza kana ichienzaniswa neyechinyakare kuburikidza-gomba kana yepamusoro gomo tekinoroji. Nekudaro, kuomarara kweBGA solder kunoisa zvipingamupinyi zvakasiyana panguva yekugadzira. Pano, tichaongorora matambudziko akatarisana nawo muBGA soldering uye kukurukura mazano anoshanda ekuagadzirisa.
Chii chinonzi BGA Soldering?
BGA solder inzira inosanganisira kusungirirwa kwemapaketi edunhu akabatanidzwa kuPCB uchishandisa nhevedzano yemabhora ekutengesa. Aya mabhora ekutengesa anowanzo kugadzirwa nelead-based or lead-free alloys, zvichienderana nemirairo yezvakatipoteredza uye zvinodiwa chaizvo. Iyo BGA package ine substrate, iyo inoshanda semutakuri weiyo yakabatanidzwa redunhu, uye solder mabhora anoumba magetsi uye emagetsi kubatana pakati pepakeji nePCB.
Kukosha kweBGA Soldering muElectronics Manufacturing
BGA solder inoita basa rakakosha mukugadzirwa kwezvinhu zvakasiyana siyana zvemagetsi zvakaita semakomputa, mafoni, uye mitambo yemitambo. Kuwedzera kudiwa kwezvidiki uye zvine simba zvemagetsi kwakafambisa kutorwa kweBGA mapakeji. Saizi yavo yecompact uye yakakwira pini density inoita kuti ive yakakodzera kune epamberi maapplication uko nzvimbo ine shoma.
Matambudziko Akatarisana nawo muBGA Soldering
l Component Alignment uye Kuiswa
Rimwe rematambudziko ekutanga muBGA soldering kuve nechokwadi chekuenzanisa kwechikamu uye kuiswa paPCB. Iyo diki saizi yemabhora ekutengesa uye dense marongero eiyo BGA package inoita kuti zviome kuwana chaiyo chinzvimbo. Kusarongeka panguva yegungano kunogona kukonzera solder mabhiriji, yakavhurika yekubatanidza, kana mechanical stress pasuru.
Kugadzirisa dambudziko iri, vagadziri vanoshandisa matekinoroji epamusoro akadai seAutomated Optical Inspection (AOI) uye X-ray Inspection. Masisitimu eAOI anoshandisa makamera nemagadzirirwo emifananidzo kuona kurongeka uye kuiswa kwezvikamu zveBGA. Kuongorora kweX-ray, kune rumwe rutivi, kunobvumira vagadziri kuona pasi pePCB uye kuona chero kusarongeka kana hurema husingaonekwe nemeso.
l Solder Paste Application
Rimwe dambudziko rakakosha muBGA soldering kuwana chaiyo uye inowirirana solder paste application. Solder paste (http://www.bestpcbs.com/blog/2022/08/why-solder-paste-became-dry-and-how-to-solve-this-problem/) , musanganiswa we solder alloy uye flux , inoiswa kuPCB pads isati yaisa BGA package. Kusakwana kana kuwandisa solder paste kunogona kutungamira kune solder kuremara sekunge kusakwana solder majoini, solder voids, kana solder bridging.
Kuti ukunde dambudziko iri, kutarisisa kunofanirwa kupihwa kune dhizaini yekugadzira uye kusarudzwa kweaperture. Stencils ane ukobvu hwakakodzera uye akaenzana saizi apertures anovimbisa chaiyo solder paste deposition. Pamusoro pezvo, vagadziri vanogona kushandisa Solder Paste Inspection (SPI) masisitimu kuti vaone kunaka uye kuenderana kweiyo solder paste yakaiswa. Iyo solder paste inoshandiswa Best Technology ndeyeSAC305 solder paste.
l Tembiricha Profile
Tembiricha profiling, kana isu tinogona kutaura thermal manejimendi, yakakosha muBGA solder kuti ive nechokwadi chekuyerera kwakaringana kweiyo solder paste. Iyo yekudzokorodza maitiro inosanganisira kuisa pasi PCB kune yakanyatsodzorwa tembiricha chimiro, ichibvumira solder paste kunyunguduka, kuumba mubatanidzwa wakavimbika, uye kusimba. Kusakwana tembiricha profiling kunogona kutungamira kune kusakwana solder wetting, isina kukwana reflow, kana kupisa kukuvadza kune zvikamu.
Vagadziri vanofanirwa kukwidziridza iyo reflow oven setup uye calibration kuti vawane iyo chaiyo tembiricha mbiri. Thermal profiling matekiniki, akadai sekushandisa thermocouples uye data loggers, anobatsira kutarisa uye kudzora tembiricha panguva yekudzokorodza maitiro.
l Reflow Process
Iyo yekudzokorodza maitiro pachayo inopa matambudziko muBGA solder. Iyo soak zone, ramp rates, uye peak tembiricha inofanirwa kudzorwa zvine hungwaru kudzivirira kupisa kushushikana pane izvo zvikamu uye kuve nechokwadi chakakodzera solder kuyerera. Kusakwana kudzora tembiricha kana zvisina kufanira ramp rates zvinogona kukonzera solder defects se tombstoneing, chikamu warpage, kana voids mune solder majoini.
Vagadziri vanofanirwa kufunga nezve izvo chaizvo zvinodikanwa zvepasuru yeBGA uye nekutevera yakakurudzirwa reflow profiles inopihwa nevanopa chikamu. Kutonhora kwakakodzera mushure mekuyerera zvakare kwakakosha kudzivirira kutyisa kwekushisa uye kuve nechokwadi kugadzikana kwemajoini solder.
l Kuongorora uye Kudzora Kwemhando
Kuongorora uye kutonga kwemhando zvinhu zvakakosha zveBGA solder kuti ive nechokwadi chekuvimbika uye kuita kwemasolder majoini. Automated Optical Inspection (AOI) masisitimu uye X-ray inspection inowanzo shandiswa kuona zvakakanganiswa senge kusarongeka, kusakwana kunyorova solder, solder bridging, kana voids mumajoini anotengeswa.
Pamusoro pemaitiro ekuongorora ekuona, vamwe vagadziri vanogona kuita ongororo yechikamu-chikamu, apo sample solder joint inochekwa uye kuongororwa pasi pe microscope. Kuongorora uku kunopa ruzivo rwakakosha pamusoro pemhando yejoint solder, senge solder wetting, void formation, kana kuvapo kwe intermetallic compounds.
BGA solder inopa akasiyana matambudziko mukugadzira zvemagetsi, zvine chekuita neakasiyana zvinhu. Nekugadzirisa matambudziko aya zvinobudirira, vagadziri vanogona kuve nechokwadi chekuvimbika uye kushanda kweBGA solder joints, zvichibatsira mukugadzirwa kwemhando yepamusoro yezvigadzirwa zvemagetsi.
