Best Technology ndeimwe yakanakisisa pcb vagadziri uye akadhindwa redunhu bhodhi vatengesi mu China
Mutauro
Best Technology ndeimwe yakanakisisa pcb vagadziri uye akadhindwa redunhu bhodhi vatengesi mu China
BGA, zita rayo rakazara iBall Grid Array, inova nzira yekurongedza umo masekete akasanganiswa anoshandisa organic carrier board.
Mabhodhi ePCB ane BGA ane mapini akawanda ekubatanidza kupfuura maPCB akajairwa. Imwe neimwe pfungwa paBGA board inogona kutengeswa yakazvimirira. Kubatana kwese kweaya maPCB akapararira muchimiro cheyunifomu matrix kana grid yepasi. Magadzirirwo ePCB aya anobvumira pasi rese kuti rishandiswe zviri nyore pane kungoshandisa nharaunda yeperipheral.
Mapini epasuru yeBGA mapfupi kwazvo pane akajairwa PCB nekuti inongori nechimiro chemhando yeperimeter. Nechikonzero ichi, inogona kupa kuita kurinani pakumhanya kwakanyanya. BGA welding inoda kudzora chaiko uye kazhinji inotungamirwa nemichina otomatiki.
We can solder the PCB with very small BGA size even the distance between the ball is only 0.1mm.
