Best Technology ndeimwe yakanakisisa pcb vagadziri uye akadhindwa redunhu bhodhi vatengesi mu China
Mutauro
Best Technology ndeimwe yakanakisisa pcb vagadziri uye akadhindwa redunhu bhodhi vatengesi mu China
High Density Interconnects (HDI) bhodhi inotsanangurwa sebhodhi (PCB) ine yakakwirira wiring density per unit area pane yakajairwa akadhindwa edunhu mabhodhi (PCB). Vane mitsetse yakanaka uye nzvimbo (<100 µm), diki vias (<150 µm) uye mapepa ekutora (<400 o="">300, uye yakakwirira yekubatanidza pad density (>20 pads/cm2) pane anoshandirwa mune yakajairika PCB tekinoroji. HDI bhodhi rinoshandiswa kuderedza ukuru uye uremu, pamwe nekusimudzira kushanda kwemagetsi.
Zvinoenderana nekudzika kumusoro kwakasiyana, parizvino DHI bhodhi rakakamurwa kuita matatu emhando mhando:
1) HDI PCB (1+N+1)
Features:
Inokodzera BGA ine yakaderera I/O kuverenga
Fine line, microvia uye kunyoresa matekinoroji anokwanisa 0.4 mm bhora pitch
Yakakodzera zvinhu uye kurapwa kwepamusoro kweLead-isina maitiro
Yakanakisa inokwira kugadzikana uye kuvimbika
Mhangura yakazadzwa kuburikidza
Kushandisa: Nharembozha, UMPC, MP3 Player, PMP, GPS, Memory Card
2) HDI PCB (2+N+2)
Features:
Inokodzera BGA ine diki bhora pitch uye yepamusoro I/O kuverenga
Wedzera density yenzira mune yakaoma dhizaini
Nhete dzebhodhi kugona
Lower Dk / Df zvinhu zvinogonesa zvirinani kutapurirana chiratidzo kuita
Mhangura yakazadzwa kuburikidza
Kushanda: Nharembozha, PDA, UMPC, Inotakurika mutambo koni, DSC, Camcorder
3) ELIC (Yese Layer Interconnection)
Features:
Yese layer kuburikidza nechimiro inowedzera rusununguko rwekugadzira
Copper yakazadzwa kuburikidza inopa kuvimbika kuri nani
Superior magetsi maitiro
Cu bump uye metal paste tekinoroji yebhodhi rakatetepa kwazvo
Kushandisa: Nharembozha, UMPC, MP3, PMP, GPS, Memory card.
