In habka wax soo saarka PCB, sida caadiga ah waa lagama maarmaan in la aaso godad, resin god godka si fudud godka derbiga copper dahaadhay, la epoxy resin buuxin godad, ka dibna copper on the surface.Isticmaalka habka dalool xabagta, dusha saxan PCB ah. ma laha dalool, daloolkuna wuxuu noqon karaa mid wax ku ool ah oo ma saameynayo alxanka, sidaas darteed qaar ka mid ah alaabooyinka leh lakabyo sare iyo dhumuc weyn oo saxan ah ayaa la door bidaa.
Isla markii ay BGA noqotay doorashada ugu fiican ee cufnaanta sare, waxqabadka sare, hawlaha badan iyo baakadaha sare I / O pin ee chips VLSI sida CPU iyo North-South Bridge. Sifooyinkeedu waa:
1.In kasta oo tirada I / O biinanka la kordhiyo, kala dheereynta biinanka ayaa aad uga weyn QFP, sidaas darteed hagaajinta wax-soo-saarka golaha;
2. Inkasta oo isticmaalkeeda koronto uu kordho, BGA waxaa lagu alxan karaa habka jajabka burburka ee la xakameyn karo, ama alxanka C4, kaas oo hagaajin kara waxqabadkiisa kuleylka korontada;
3. Dhumucdiisu waxay ka badan tahay 1/2 in ka yar QFP, miisaankana waxaa la dhimay in ka badan 3/4;
4. Xuduudaha dulin ayaa la dhimay, dib u dhigista gudbinta calaamaduhu waa yar yahay, iyo inta jeer ee isticmaalka ayaa si weyn loo hagaajiyay;
5. Isku-dhafka waxaa loo isticmaali karaa alxanka caadiga ah, oo leh kalsooni sare;
Baakadaha 6.BGA ayaa wali la mid ah QFP, PGA, qabsashada aagga substrate aad buu u weyn yahay;
Sharaxaada | Tilmaamid |
Lakabyada PCB | 6L FR4 PCB |
Qalabka saldhigga ah | Tg160 |
dhumucda PCB | 4.5mm+/-10% |
Nooca Copper | 9`OZ copper ee lakab kasta |
Dhamaystirka dusha sare | ENIG |
Farsamada | Xidhmada Array Grid |
Cagaaran | Maaskarada alxanka |
Shaashada xariirta | Caddaan |
Kaliya ku dhaaf iimaylkaaga ama lambarka taleefankaaga foomka xiriirka si aan kuugu soo dirno xigasho bilaash ah oo loogu talagalay naqshadeena ballaaran!