Molemo ka ho fetisisa Theknoloji ke e mong oa molemo ka ho fetisisa bahlahisi ba pcb le bafepedi ba boto e hatisitsoeng ka China
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Molemo ka ho fetisisa Theknoloji ke e mong oa molemo ka ho fetisisa bahlahisi ba pcb le bafepedi ba boto e hatisitsoeng ka China
BGA (Ball Grid Array) soldering ke mokhoa o sebelisoang haholo indastering ea tlhahiso ea lisebelisoa tsa elektronike bakeng sa ho kenya li-circuits tse kopantsoeng holim'a liboto tsa potoloho tse hatisitsoeng (PCBs). Mokhoa ona o fana ka khokahano e kopaneng le e tšepahalang ha e bapisoa le thekenoloji ea setso ka lesoba kapa holim'a metsi. Leha ho le joalo, ho rarahana ha BGA soldering ho baka litšitiso tse fapaneng nakong ea ts'ebetso ea tlhahiso. Mona, re tla hlahloba mathata a tobaneng le BGA soldering le ho buisana ka maano a sebetsang a ho a rarolla.
BGA Soldering ke eng?
BGA soldering ke mokhoa o kenyelletsang ho hokela liphutheloana tse kopaneng tsa potoloho ho PCB ho sebelisoa libolo tsa solder. Libolo tsena tsa solder hangata li entsoe ka li-alloys tse thehiloeng ho loto kapa tse se nang lead, ho latela melao ea tikoloho le litlhoko tse ikhethang. Sephutheloana sa BGA se na le substrate, e sebetsang e le sesebelisoa sa potoloho e kopaneng, le libolo tsa solder tse etsang likhokahano tsa motlakase le tsa mochini lipakeng tsa sephutheloana le PCB.
Bohlokoa ba BGA Soldering ho Electronics Manufacturing
BGA soldering e bapala karolo ea bohlokoa tlhahisong ea lisebelisoa tse fapaneng tsa elektroniki joalo ka likhomphutha, li-smartphones le lisebelisoa tsa lipapali. Tlhokahalo e ntseng e eketseha ea lisebelisoa tsa elektroniki tse nyane le tse matla ho feta e tsamaisitse ho amoheloa ha liphutheloana tsa BGA. Boholo ba tsona bo kopaneng le pini e phahameng li etsa hore li tšoanelehe bakeng sa lits'ebetso tse tsoetseng pele moo sebaka se lekanyelitsoeng.
Mathata a tobaneng le BGA Soldering
l Tokiso ea Karolo le ho Bea
E 'ngoe ea liqholotso tsa mantlha ho BGA soldering ke ho netefatsa hore likarolo li tsamaisana hantle le ho beoa ho PCB. Boholo bo bonyenyane ba libolo tsa solder le sebopeho se teteaneng sa sephutheloana sa BGA se etsa hore ho be thata ho fumana boemo bo nepahetseng. Ho se tsitsisehe nakong ea kopano ho ka fella ka marokho a solder, likhokahano tse bulehileng, kapa khatello ea mochini sephutheloaneng.
Ho rarolla phephetso ena, bahlahisi ba sebelisa mekhoa e tsoetseng pele e kang Automated Optical Inspection (AOI) le X-ray Inspection. Litsamaiso tsa AOI li sebelisa lik'hamera le li-algorithms tsa ts'ebetso ea litšoantšo ho netefatsa tatellano e nepahetseng le ho beoa ha likarolo tsa BGA. Ka lehlakoreng le leng, tlhahlobo ea X-ray e lumella bahlahisi hore ba bone ka tlas'a bokaholimo ba PCB le ho lemoha ho se nepahale leha e le hofe kapa likoli tse ka 'nang tsa se ke tsa bonahala ka mahlo.
l Sesebelisoa sa Solder Paste
Phephetso e 'ngoe ea bohlokoa ho BGA soldering ke ho fihlella ts'ebeliso e nepahetseng le e tsitsitseng ea peista ea solder. Solder paste (http://www.bestpcbs.com/blog/2022/08/why-solder-paste-became-dry-and-how-to-solve-this-problem/) , motsoako oa motsoako oa solder le flux , e sebelisoa ho li-pads tsa PCB pele u beha sephutheloana sa BGA. Sekhahla se sa lekaneng kapa se feteletseng sa solder se ka lebisa ho bofokoli ba solder joalo ka li-solder tse sa lekaneng, li-solder voids, kapa borokho ba solder.
Ho hlōla phephetso ena, ho lokela ho hlokomeloa ka hloko moralo oa li-stencil le khetho ea lesoba. Li-stencil tse nang le botenya bo nepahetseng le li-apertures tse boholo bo lekaneng li netefatsa hore ho behiloe peista ea solder e nepahetseng. Ho feta moo, bahlahisi ba ka sebelisa lisebelisoa tsa Solder Paste Inspection (SPI) ho netefatsa boleng le ho tsitsa ha solder pente e sebelisitsoeng. Sehlahisoa sa solder se sebelisoang ke Theknoloji e Molemohali ke SAC305 solder peste.
l Boemo ba Mocheso
Profiling ea mocheso, kapa re ka re tsamaiso ea mocheso, e bohlokoa ho BGA soldering ho netefatsa hore ho phalla hantle ha pente ea solder. Ts'ebetso ea reflow e kenyelletsa ho beha PCB ho profil ea mocheso e laoloang ka hloko, e lumellang solder paste ho qhibiliha, ho theha lenonyeletso le tšepahalang, le ho tiisa. Tlhaloso e sa lekaneng ea mocheso e ka lebisa ho solder wetting e sa lekaneng, ho phalla ho sa fellang, kapa ho senyeha ha mocheso likarolong.
Baetsi ba tlameha ho ntlafatsa setaele sa ontong ea reflow le calibration ho fihlela boemo bo nepahetseng ba mocheso. Mekhoa ea ho hlahisa mocheso, joalo ka tšebeliso ea li-thermocouples le li-logger tsa data, li thusa ho shebella le ho laola mocheso nakong ea ts'ebetso ea ho khutlisa.
l Ts'ebetso ea Reflow
Ts'ebetso ea reflow ka boeona e hlahisa mathata ho BGA soldering. Sebaka sa soak, litekanyetso tsa marang-rang, le mocheso o phahameng oa mocheso li tlameha ho laoloa ka hloko ho thibela khatello ea mocheso holim'a likarolo le ho netefatsa hore solder e phalla hantle. Taolo e sa lekaneng ea mocheso kapa likhahla tse sa nepahalang tsa marang-rang li ka fella ka mefokolo ea solder joalo ka tombstoneing, component warpage, kapa voids manonyeletsong a solder.
Baetsi ba lokela ho nahana ka litlhoko tse khethehileng tsa sephutheloana sa BGA 'me ba latele lintlha tse khothaletsoang tse fanoeng ke bafani ba likarolo. Pholiso e nepahetseng ka mor'a ho phalla hape ke ea bohlokoa ho thibela mocheso oa mocheso le ho netefatsa botsitso ba manonyeletso a solder.
l Tlhahlobo le Taolo ea Boleng
Tlhahlobo le taolo ea boleng ke lintlha tsa bohlokoa tsa BGA soldering ho netefatsa ho ts'epahala le ts'ebetso ea manonyeletso a solder. Lits'ebetso tsa Automated Optical Inspection (AOI) le tlhahlobo ea X-ray hangata li sebelisoa ho bona mefokolo joalo ka ho se tsamaisane hantle, ho se lekane ho kolobisa ka solder, bridging ea solder, kapa likheo tsa manonyeletso a solder.
Ntle le mekhoa ea ho hlahloba pono, bahlahisi ba bang ba ka etsa tlhahlobo ea likarolo tse fapaneng, moo motsoako oa solder o khaoloang ebe o hlahlojoa ka tlas'a microscope. Tlhahlobo ena e fana ka tlhahisoleseding ea bohlokoa mabapi le boleng ba motsoako oa solder, joalo ka solder wetting, void formation, kapa boteng ba metsoako ea intermetallic.
BGA soldering e hlahisa mathata a ikhethang tlhahisong ea lisebelisoa tsa elektroniki, haholo-holo tse amanang le lintlha tse fapaneng. Ka ho sebetsana le mathata ana ka katleho, bahlahisi ba ka etsa bonnete ba ho tšepahala le ts'ebetso ea li-joints tsa BGA solder, ho kenya letsoho tlhahisong ea lisebelisoa tsa elektronike tsa boleng bo phahameng.
