Lera le bonolo la lehlakore le le lengMCPCB e na le motheo oa tšepe (hangata aluminium, kapa alloy ea koporo), Lera la Dielectric (le sa sebetseng), Lera la Potoloho ea Koporo, likarolo tsa IC le mask a solder.


The prepreg dielectric e fana ka phetisetso e ntle ea mocheso ho tloha foil le likarolo ho ea poleiti ea motheo, ha e ntse e boloka karohano e ntle ea motlakase. The base aluminium/copper plate e fana ka lehlakore le le leng la substrate integrity, 'me e aba le ho fetisetsa mocheso setšeng sa mocheso, holim'a metsi kapa ka ho toba moeeng o potolohileng.


The Single-Layer MCPCB e ka sebelisoa ka holim'a thaba le chip& terata mme e fana ka khanyetso e tlase haholo ea mocheso ho feta FR4 PWB. Mokotla oa tšepe o fana ka litšenyehelo tse tlase ho feta li-ceramic substrates mme o lumella libaka tse kholoanyane ho feta li-ceramic substrates.


Letoto la MCPCB le tsoang ho Best Technology le thehiloe ho ipapisitse le boiteko bo sa feleng. Lihlahisoa tsa ronaMoetsi oa MCPCB ka thepa e ntle, theknoloji e tsoetseng pele ea tlhahiso, le mekhoa e metle ea tlhahiso e sebelisoa tlhahisong ea lihlahisoa tsa litlolo tse sa feleng. E entsoe ka mokhoa o motle le boleng bo botle 'me e rekisoa hantle' marakeng oa malapeng. Haeba u batla setsebiBafani ba MCPCB, amohelehile ho etela moetsi oa Best Technology MCPCB.


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