Best Technology yenye abavelisi pcb ilungileyo eprintiweyo ababoneleli ngebhodi yesekethe e China
Ulwimi
Best Technology yenye abavelisi pcb ilungileyo eprintiweyo ababoneleli ngebhodi yesekethe e China
I-BGA (i-Ball Grid Array) i-soldering yindlela esetyenziswa ngokubanzi kwishishini lokuvelisa i-electronics yokunyuswa kweesekethe ezidibeneyo kwiibhodi zesekethe eziprintiweyo (PCBs). Le ndlela ibonelela ngoqhagamshelo olubambene ngakumbi noluthembekileyo xa kuthelekiswa nomngxuma wemveli okanye umphezulu weteknoloji. Nangona kunjalo, ubunzima be-BGA soldering bubeka imiqobo eyahlukeneyo ngexesha lenkqubo yokuvelisa. Apha, siza kuphonononga imingeni esijongene nayo kwi-BGA soldering kwaye sixoxe ngezicwangciso ezisebenzayo zokuyilungisa.
Yintoni iBGA Soldering?
I-BGA soldering bubuchule obubandakanya uncamathiselo lweepakethe ezidityanisiweyo zesekethe kwi-PCB kusetyenziswa uluhlu lweebhola ze-solder. Ezi bhola ze-solder ngokuqhelekileyo zenziwe nge-alloys esekelwe kwi-load okanye i-lead-free, ngokuxhomekeke kwimimiselo yokusingqongileyo kunye neemfuno ezithile. Iphakheji ye-BGA iqulethe i-substrate, esebenza njengomphathi wesekethe edibeneyo, kunye neebhola ze-solder ezenza uqhagamshelwano lombane kunye noomatshini phakathi kwephakheji kunye ne-PCB.
Ukubaluleka kwe-BGA Soldering kwi-Electronics Manufacturing
Ukuthengiswa kwe-BGA kudlala indima ebalulekileyo ekwenziweni kwezixhobo ezahlukeneyo zombane ezinjengeekhompyuter, ii-smartphones, kunye nemidlalo yokudlala. Imfuno eyongeziweyo yee-elektroniki ezincinci kunye ezinamandla ngakumbi ziqhube ukwamkelwa kweepakethe ze-BGA. Ubungakanani babo obubambeneyo kunye nokuxinana kwephini eliphezulu kubenza bafanelekele usetyenziso oluphambili apho indawo incinyiweyo.
Imingeni ejongene neBGA Soldering
l Ulungelelwaniso lweCandelo kunye nokubekwa
Omnye wemingeni ephambili kwi-BGA soldering kukuqinisekisa ukulungelelaniswa kwecandelo kunye nokubekwa kwi-PCB. Ubungakanani obuncinci beebhola ze-solder kunye ne-dense layout ye-package ye-BGA yenza kube nzima ukufikelela kwindawo echanekileyo. Ukungahambi kakuhle ngexesha lenkqubo yendibano kunokubangela iibhulorho ze-solder, ukudibanisa okuvulekileyo, okanye uxinzelelo lomatshini kwiphakheji.
Ukujongana nalo mceli mngeni, abavelisi basebenzisa ubugcisa obuphambili obufana noHlolo oluSebenzayo lwe-Optical Inspection (AOI) kunye noHlolo lweX-reyi. Iinkqubo ze-AOI zisebenzisa iikhamera kunye ne-algorithms yokucubungula imifanekiso ukuqinisekisa ukulungelelaniswa okuchanekileyo kunye nokubekwa kwamacandelo e-BGA. Ukuhlolwa kwe-X-reyi, kwelinye icala, kuvumela abavelisi ukuba babone ngaphantsi kwe-PCB kwaye babone nakuphi na ukungahambi kakuhle okanye iziphene ezinokuthi zingabonakali ngeso lenyama.
l Isicelo seNcamathelo ye-Solder
Omnye umngeni obalulekileyo kwi-BGA yokuthengisela kukuphumeza isicelo esichanekileyo nesihambelanayo se-solder. I-Solder paste (http://www.bestpcbs.com/blog/2022/08/why-solder-paste-became-dry-and-how-to-solve-this-problem/) , umxube we-solder alloy kunye ne-flux , isetyenziswa kwi pads PCB phambi kokubeka iphakheji BGA. Ukunganelanga okanye ukuncamathela kwe-solder okugqithisileyo kunokukhokelela kwiziphene ze-solder ezifana nokungonelanga kwamalungu e-solder, i-solder voids, okanye i-solder bridging.
Ukoyisa lo mngeni, kufuneka kuqwalaselwe ngononophelo uyilo lwe-stencil kunye nokukhetha indawo yokuvula. Iistencils ezinobungqingqwa obufanelekileyo kunye neendawo ezinobungakanani obufanelekileyo ziqinisekisa ukubekwa kwe-solder paste echanekileyo. Ukongezelela, abavelisi banokusebenzisa iinkqubo ze-Solder Paste Inspection (SPI) ukuqinisekisa umgangatho kunye nokuhambelana kwe-solder paste esetyenziswayo. Intlama ye-solder esetyenziswa kakhulu yiTekhnoloji ye-SAC305.
l Ingxelo yobushushu
Iprofayili yobushushu, okanye sinokuthi ulawulo lwe-thermal, lubalulekile kwi-BGA soldering ukuqinisekisa ukugeleza okufanelekileyo kwe-solder paste. Inkqubo yokubuyisela kwakhona ibandakanya ukuthobela i-PCB kwiprofayili yokushisa elawulwa ngononophelo, ukuvumela i-solder paste inyibilike, yenze ukudibanisa okuthembekileyo, kunye nokuqinisa. Ukungonelanga kweprofayili yeqondo lokushisa kunokukhokelela kwi-solder enganelanga, ukugeleza kwakhona okungaphelelanga, okanye umonakalo wokushisa kumalungu.
Abavelisi kufuneka bandise ukusetwa kwe-oveni yokuqukuqela kunye nokulinganisa ukufikelela kwiprofayile yobushushu obuchanekileyo. Ubuchwephesha beprofayili ye-Thermal, njengokusetyenziswa kwe-thermocouples kunye nabagcini bedatha, bancedisa ukubeka iliso nokulawula ubushushu ngexesha lenkqubo yokubuyisela kwakhona.
l Inkqubo yoPhumelelo
Inkqubo yokubuyisela kwakhona inikezela imingeni kwi-BGA soldering. Indawo yokufunxa, iireyithi zeerampu, kunye nobushushu obuphezulu kufuneka ilawulwe ngononophelo ukuze kuthintelwe uxinzelelo lwe-thermal kumacandelo kunye nokuqinisekisa ukugcwala kwakhona kwe-solder. Ukulawulwa kobushushu obunganelanga okanye iirempu ezingafanelekanga kunokubangela iziphene ze-solder ezifana ne-tombstoneing, i-warpage yecandelo, okanye i-voids kumalungu e-solder.
Abavelisi kufuneka bathathele ingqalelo iimfuno ezithile zephakheji ye-BGA kwaye balandele iiprofayili ezicetyiswayo zokuphinda zenziwe kwakhona ezibonelelwa ngabaxhasi bamacandelo. Ukupholisa okufanelekileyo emva kokuhamba kwakhona kubalulekile ukukhusela ukutshatyalaliswa kwe-thermal kunye nokuqinisekisa ukuzinza kwamalungu e-solder.
l Ukuhlolwa kunye noLawulo loMgangatho
Ukuhlolwa kunye nokulawulwa komgangatho kuyimiba ebalulekileyo ye-BGA soldering ukuqinisekisa ukuthembeka kunye nokusebenza kwamalungu e-solder. Iinkqubo zokuHlola okuSebenzayo (i-AOI) kunye nokuhlolwa kwe-X-reyi ziqhele ukusetyenziselwa ukubona iziphene ezinje ngokungahambi kakuhle, ukumanzisa okungonelanga kwe-solder, i-solder bridging, okanye i-voids kumalungu e-solder.
Ukongeza kwiindlela zokuhlola ezibonwayo, abanye abavelisi banokwenza uhlalutyo lwecandelo elinqamlezayo, apho isampula ye-solder inqunywe kwaye ihlolwe phantsi kwe-microscope. Olu hlalutyo lunikeza ulwazi oluxabisekileyo malunga nomgangatho we-solder joint, ezifana ne-solder wetting, i-void formation, okanye ubukho be-intermetallic compounds.
I-BGA soldering inikezela ngemingeni ekhethekileyo kwimveliso ye-elektroniki, eyona nto inxulumene nezinto ezahlukeneyo. Ngokujongana nale mingeni ngokufanelekileyo, abavelisi banokuqinisekisa ukuthembeka kunye nokusebenza kwe-BGA ye-solder joints, igalelo ekuvelisweni kwezixhobo zombane eziphezulu.
