Ngendibano PCB umngxuma kukusebenzisa itekhnoloji ye-reflow soldering ukudibanisa iikhomponenti zomngxuma kunye nezinto ezinokwakheka okukhethekileyo. Njengoko namhlanje iimveliso zihlawula ingqalelo ngakumbi nangakumbi kwi-miniaturization, ukusebenza okwandisiweyo kunye nokwanda koxinzelelo lwecandelo, iiphaneli ezininzi ezicalanye kunye namacala amabini ziyinxalenye ephezulu.
Isitshixo sokusebenzisa izixhobo zombhobho kwiibhodi zeesekethe ezinezixhobo ezixhonywe phezulu kukukwazi ukubonelela nge-soldering ye-reflow ngaxeshanye kwi-hole kunye ne-surface-mount-mount components kwinkqubo enye edibeneyo.
Xa kuthelekiswa nenkqubo yokunyuswa komphezulu jikelele, ubungakanani bentlama ye-solder esetyenziswa kwi-PCBngendibano umngxuma ingaphezulu kwaleyo ye-SMT ngokubanzi, malunga namaxesha angama-30. Okwangoku, indibano yePCB yomngxuma isebenzisa iitekhnoloji ezimbini zokuncamathisela ze-solder, kubandakanya ushicilelo lwe-solder paste kunye ne-automatic solder paste.