Best Technology yenye abavelisi pcb ilungileyo eprintiweyo ababoneleli ngebhodi yesekethe e China
Ulwimi
Best Technology yenye abavelisi pcb ilungileyo eprintiweyo ababoneleli ngebhodi yesekethe e China
I-BGA, igama layo elipheleleyo yi-Ball Grid Array, eluhlobo lwendlela yokupakisha apho iisekethe ezidibeneyo zisebenzisa iibhodi ze-organic carrier.
Iibhodi ze-PCB ezine-BGA zinezikhonkwane zoqhagamshelo ezininzi kuneePCB eziqhelekileyo. Inqaku ngalinye kwibhodi ye-BGA inokuthengiswa ngokuzimeleyo. Udibaniso lulonke lwezi PCBs luthe saa ngendlela ye-matrix efanayo okanye igridi yomphezulu. Uyilo lwezi PCBs luvumela wonke umphezulu osezantsi ukuba usetyenziswe ngokulula endaweni yokusebenzisa nje ummandla weperipheral.
Izikhonkwane zepakethe ye-BGA zifutshane kakhulu kune-PCB eqhelekileyo kuba inemilo yohlobo lweperimeter kuphela. Ngenxa yesi sizathu, inokubonelela ngentsebenzo engcono ngesantya esiphezulu. I-BGA welding ifuna ulawulo oluchanekileyo kwaye isoloko ikhokelwa ngoomatshini abazenzekelayo.
We nga solder PCB kunye nesayizi encinane kakhulu BGA nokuba umgama phakathi kwebhola kuphela 0.1mm.
