I-Metal Core PCB ithetha isiseko (isiseko) sezinto ze-PCB yintsimbi, kungekhona i-FR4 / CEM1-3 eqhelekileyo, njl. kwaye okwangoku isinyithi esiqhelekileyo esisetyenziselwa umenzi we-MCPCB yi-Aluminium, iCopper kunye ne-alloy yensimbi. I-aluminiyam inamandla okuhambisa ubushushu kunye nokukwazi ukubutshabalalisa, kodwa ingabizi kakhulu; ubhedu lusebenza ngcono ngakumbi kodwa lubiza kakhulu, kwaye intsimbi inokohlulwa ibe yintsimbi eqhelekileyo kunye nentsimbi engatyiwayo. Iqinile ngakumbi kune-aluminiyam kunye nobhedu, kodwa i-thermal conductivity iphantsi kunabo nayo. Abantu baya kukhetha isiseko sabo / imathiriyeli engundoqo ngokwesicelo sabo esahlukileyo.

Ngokubanzi, i-aluminiyam lolona khetho loqoqosho luthathela ingqalelo i-thermal conductivity, ukuqina, kunye neendleko. Ke ngoko, izinto ezisisiseko/ezingundoqo zeMetal Core PCB eqhelekileyo zenziwe ngealuminiyam. Kwinkampani yethu, ukuba akusiyo isicelo esikhethekileyo, okanye amanqaku, i-metal core reference iya kuba yi-aluminium, ngoko i-MCPCB iya kuthetha i-Aluminium Core PCB. Ukuba ufuna i-Copper Core PCB, i-Steel Core PCB, okanye i-Stainless steel core PCB, kufuneka udibanise amanqaku akhethekileyo ekuzobeni.

Ngamanye amaxesha abantu baya kusebenzisa isishunqulelo esithi “MCPCB”, endaweni yegama elipheleleyo njengeMetal Core PCB, okanye iBhodi yeSekethe eShicileleyo yeMetal. Kwaye kusetyenziswe igama elahlukileyo libhekisa undoqo/isiseko, ke uya kubona kwakhona igama elahlukileyo le-Metal Core PCB, njenge.  I-Metal PCB, i-Metal Base PCB, i-Metal Backed PCB, i-Metal Clad PCB kunye neBhodi yeMetal Core njalo njalo.

I-MCPCBs isetyenziswa endaweni ye-FR4 yemveli okanye i-CEM3 PCBs ngenxa yokukwazi ukutshabalalisa ngokufanelekileyo ubushushu kude nezinto. Oku kuphunyezwa ngokusebenzisa iThermally Conductive Dielectric Layer.

Umahluko omkhulu phakathi kwebhodi ye-FR4 kunye ne-MCPCB yi-thermal conductivity dielectric material kwi-MCPCB. Oku kusebenza njengebhulorho eshushu phakathi kwamacandelo e-IC kunye nepleyiti yokuxhasa isinyithi. Ukushisa kuqhutyelwa kwipakethe ngentsimbi yentsimbi ukuya kwisitya esongezelelweyo sokushisa. Kwibhodi ye-FR4 ubushushu buhlala bumile ukuba abudluliswanga yi-heatsink ye-topical. Ngokutsho kwelebhu yokuvavanya i-MCPCB ene-1W LED yahlala kufuphi ne-ambient ye-25C, ngelixa i-1W efanayo ye-LED kwibhodi ye-FR4 ifikelele kwi-12C ngaphezu kwe-ambient. I-LED PCB ihlala iveliswa nge-Aluminiyam engundoqo, kodwa ngamanye amaxesha i-PCB engundoqo yentsimbi nayo iyasetyenziswa.

Uncedo lwe-MCPCB

1.ukuchithwa kobushushu

Ezinye ii-LED zichitha phakathi kwe-2-5W yokushisa kunye nokungaphumeleli kwenzeka xa ukushisa kwi-LED kungasuswanga ngokufanelekileyo; Ukukhutshwa kokukhanya kwe-LED kuncitshisiwe kunye nokuthotywa xa ubushushu buhlala bumile kwiphakheji ye-LED. Injongo ye-MCPCB kukususa ngokufanelekileyo ubushushu kuzo zonke ii-IC's (kungekhona nje ii-LEDs). Isiseko se-aluminium kunye ne-thermal conductive dielectric layer isebenza njengeebhulorho phakathi kwe-IC kunye ne-heat sink. Isinki enye yobushushu ixhonywe ngokuthe ngqo kwisiseko se-aluminiyam isusa imfuneko yeesinki zobushushu ezininzi phezu kwezinto ezixhonywe phezulu.

2. ukwanda kwe-thermal

Ukwandiswa kwe-Thermal kunye nokunciphisa yinto eqhelekileyo yezinto, i-CTE eyahlukileyo iyahluka ekwandiseni kwe-thermal. Njengeempawu zayo, i-aluminiyam kunye nobhedu zineemeko ezizodwa zangaphambili kune-FR4 eqhelekileyo, i-thermal conductivity ingaba yi-0.8 ~ 3.0 W / c.K.

3. uzinzo lwe-dimensional

Kucacile ukuba ubungakanani bebhodi yesekethe eprintiweyo esekelwe kwisinyithi izinzile kunezinto zokukhusela. Ubungakanani utshintsho lwe-2.5 ~ 3.0% xa i-Aluminiyam PCB kunye neepaneli zesandwich ze-aluminium zifudunyezwe ukusuka kwi-30 ℃ ukuya kwi-140 ~ 150 ℃.


Wamkelekile ukutyelela Best Technology metal core pcb umenzi.

Chat with Us

Thumela ingxelo yakho