Ibhodi ye-High Density Interconnects (HDI) ichazwa njengebhodi (PCB) enoxinaniso lweengcingo eziphezulu kwiyunithi yendawo nganye kuneebhodi zesekethe eziprintiweyo eziqhelekileyo (PCB). Banemigca ecolekileyo kunye nezithuba (<100 µm), ngendlela encinci (<150 µm) kunye neepads zokubamba (<400 o="">300, kunye noxinaniso lwephedi ephezulu (>20 pads/cm2) kunomsebenzi weteknoloji yePCB eqhelekileyo. Ibhodi ye-HDI isetyenziselwa ukunciphisa ubungakanani kunye nobunzima, kunye nokuphucula ukusebenza kombane.

Ngokomaleko ngokwahlukileyo, okwangoku ibhodi ye-DHI yahlulwe yaba ziindidi ezintathu ezisisiseko:

1) HDI PCB (1+N+1) 

Iimbonakalo: 

Ifanelekile kwi-BGA enamanani aphantsi e-I/O

I-Fine line, i-microvia kunye ne-registration technologies ekwazi ukwenza ibhola ye-0.4 mm

Izinto ezifanelekileyo kunye nonyango lwangaphezulu lwenkqubo engenalo iLead

Ukugqwesa uzinzo kunye nokuthembeka

Ubhedu lugcwaliswe nge

Isicelo: Iselfowuni, UMPC, MP3 Player, PMP, GPS, Memory Card

2) HDI PCB (2+N+2) 

Iimbonakalo: 

Ifanelekile kwi-BGA ene-pitch yebhola encinci kunye nezibalo eziphezulu ze-I/O

Yandisa ingxinano yeendlela kuyilo oluntsonkothileyo

Izakhono zebhodi ezincinci

Izinto ezisezantsi zikaDkt / Df zenza ngcono ukuhanjiswa komqondiso

Ubhedu lugcwaliswe nge

Isicelo: Cell phone, PDA, UMPC, Portable game console, DSC, Camcorder

3) ELIC (Lonke uQhagamshelwano lweLayer) 

Iimbonakalo: 

Lonke umaleko ngesakhiwo ukhulisa inkululeko yoyilo

Ubhedu oluzaliswe ngendlela lubonelela ngokuthembeka okungcono

Iimpawu eziphezulu zombane

I-Cu bump kunye neteknoloji yokuncamathisela yentsimbi yebhodi ebhityileyo kakhulu

Isicelo: Iselfowuni, UMPC, MP3, PMP, GPS, Imemori khadi.

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