I-Best Technology ingenye yabakhiqizi abahamba phambili be-pcb nabahlinzeki bebhodi lesifunda ephrintiwe e-China
Ulimi
I-Best Technology ingenye yabakhiqizi abahamba phambili be-pcb nabahlinzeki bebhodi lesifunda ephrintiwe e-China
I-BGA (i-Ball Grid Array) i-soldering iyindlela esetshenziswa kakhulu embonini yokukhiqiza kagesi yokukhweza amasekethe ahlanganisiwe kumabhodi esekethe aphrintiwe (ama-PCB). Le ndlela ihlinzeka ngoxhumano oluhlangene futhi olunokwethenjelwa uma kuqhathaniswa nobuchwepheshe bendabuko obudlula emgodini noma obuphezulu. Kodwa-ke, inkimbinkimbi ye-BGA soldering ibeka izithiyo ezihlukahlukene phakathi nenqubo yokukhiqiza. Lapha, sizohlola izinselele ezibhekene ne-BGA soldering futhi sixoxe ngamasu asebenzayo wokubhekana nazo.
Iyini i-BGA Soldering?
I-BGA soldering iwubuchule obubandakanya ukunamathiselwa kwamaphakheji esekethe ahlanganisiwe ku-PCB kusetshenziswa uxhaxha lwamabhola e-solder. Lawa mabhola e-solder ngokuvamile enziwe ngama-alloys asekelwe kumthofu noma angenawo umthofu, kuye ngemithetho yemvelo kanye nezidingo ezithile. Iphakheji ye-BGA iqukethe i-substrate, esebenza njengesithwali sesekethe ehlanganisiwe, namabhola e-solder akha ukuxhumana kukagesi nokomshini phakathi kwephakheji ne-PCB.
Ukubaluleka kwe-BGA Soldering Ekwenziweni Kwezogesi
I-BGA soldering idlala indima ebalulekile ekwenziweni kwezinto ezihlukahlukene ze-elekthronikhi ezifana namakhompyutha, ama-smartphone, nama-consoles emidlalo. Isidingo esikhulayo sama-elekthronikhi amancane futhi anamandla kakhulu siqhube ukwamukelwa kwamaphakheji e-BGA. Usayizi wabo ohlangene kanye nokuminyana kwamaphini amaningi kubenza bafanelekele izinhlelo zokusebenza ezithuthukile lapho isikhala silinganiselwe.
Izinselelo Ezibhekene Ne-BGA Soldering
l Ukuqondanisa Ingxenye Nokubekwa
Enye yezinselelo eziyinhloko ku-BGA soldering ukuqinisekisa ukuqondanisa okunembile kwengxenye nokubekwa ku-PCB. Ubukhulu obuncane bamabhola e-solder kanye nesakhiwo esiminyene sephakheji ye-BGA kwenza kube nzima ukufeza ukuma okunembile. Ukungaqondi kahle ngesikhathi somhlangano kungabangela amabhuloho e-solder, ukuxhumana okuvulekile, noma ukucindezeleka komshini kuphakheji.
Ukuze kubhekwane nale nselele, abakhiqizi basebenzisa ubuchwepheshe obuthuthukisiwe obufana ne-Automated Optical Inspection (AOI) kanye nokuhlolwa kwe-X-ray. Amasistimu e-AOI asebenzisa amakhamera nama-algorithms okucubungula izithombe ukuze aqinisekise ukuqondanisa okulungile nokubekwa kwezingxenye ze-BGA. Ukuhlolwa kwe-X-ray, ngakolunye uhlangothi, kuvumela abakhiqizi ukuthi babone ngaphansi kwe-PCB futhi bathole noma yikuphi ukungahambi kahle noma amaphutha okungenzeka angabonakali ngeso lenyama.
l Isicelo se-Solder Namathisela
Enye inselele ebalulekile ekuhlanganisweni kwe-BGA ukuzuza isicelo esinembe futhi esingaguquki sokunamathisela i-solder. I-solder paste (http://www.bestpcbs.com/blog/2022/08/why-solder-paste-became-dry-and-how-to-solve-this-problem/) , ingxube ye-solder alloy kanye ne-flux , isetshenziswa kumaphedi e-PCB ngaphambi kokubeka iphakheji ye-BGA. Ukunamathiswa kwe-solder okunganele noma okweqile kungaholela ekushiyekeni kwe-solder njengamajoyinti anganele, ama-solder voids, noma i-solder bridging.
Ukuze unqobe le nselele, kufanele kuqashelwe ngokucophelela ukuklama kwama-stencil nokukhetha indawo yokuvula. Ama-stencil anogqinsi olufanele kanye nezimbobo ezinosayizi ofanele aqinisekisa ukubekwa kwe-solder okunembile. Ukwengeza, abakhiqizi bangasebenzisa izinhlelo ze-Solder Paste Inspection (SPI) ukuze baqinisekise ikhwalithi nokuvumelana kokunamathiselwe kwe-solder okusetshenzisiwe. I-solder paste esetshenziswa Ubuchwepheshe Okungcono Kakhulu i-SAC305 solder paste.
l Iphrofayili Yezinga Lokushisa
Iphrofayili yezinga lokushisa, noma singasho ukuphatha okushisayo, kubalulekile ku-BGA soldering ukuqinisekisa ukugeleza kabusha okufanele kwe-solder paste. Inqubo yokugeleza kabusha ihlanganisa ukubeka i-PCB ngaphansi kwephrofayili yezinga lokushisa elawulwa ngokucophelela, okuvumela ukunamathisela kwe-solder ukuthi kuncibilike, kwakhe ukuhlanganisa okuthembekile, futhi kuqiniswe. Ukuhlaziywa kwezinga lokushisa okunganele kungaholela ekumanzini kwe-solder okunganele, ukugeleza kabusha okungaphelele, noma ukulimala okushisayo ezingxenyeni.
Abakhiqizi kufanele balungiselele ukusethwa kwe-ovini egeleza kabusha kanye nokulinganisa ukuze bafinyelele iphrofayela efanele yezinga lokushisa. Amasu okwenza iphrofayela eshisayo, njengokusetshenziswa kwama-thermocouples nabaloga bedatha, asiza ukuqapha nokulawula izinga lokushisa ngesikhathi senqubo yokugeleza kabusha.
l Inqubo Yokugeleza Kabusha
Inqubo yokugeleza kabusha ngokwayo iletha izinselele ekuhlanganisweni kwe-BGA. Indawo yokucwilisa, amanani erempu, kanye nezinga lokushisa eliphakeme kufanele kulawulwe ngokucophelela ukuze kuvinjelwe ukucindezeleka okushisayo ezingxenyeni futhi kuqinisekiswe ukugeleza kabusha kwe-solder okufanele. Ukulawulwa kwezinga lokushisa okunganele noma amazinga erempu angafanele angabangela ukonakala kwe-solder njenge-tombstoneing, i-warpage yengxenye, noma i-voids kumalunga e-solder.
Abakhiqizi badinga ukucabangela izimfuneko ezithile zephakheji ye-BGA futhi balandele amaphrofayela okugeleza kabusha anconyiwe ahlinzekwa abahlinzeki bengxenye. Ukupholisa okufanele ngemva kokugeleza kabusha kubalulekile ukuvimbela ukushaqeka okushisayo nokuqinisekisa ukuzinza kwamalunga e-solder.
l Ukuhlola Nokulawula Ikhwalithi
Ukuhlolwa nokulawulwa kwekhwalithi yizici ezibalulekile ze-BGA soldering ukuqinisekisa ukwethembeka nokusebenza kwezihlanganisi ze-solder. Amasistimu okuhlola okuzenzakalelayo (i-AOI) kanye nokuhlolwa kwe-X-ray kuvame ukusetshenziselwa ukuthola iziphambeko njengokungaqondani kahle, ukumanzisa okunganele kwe-solder, i-solder bridging, noma ama-voids kumajoyinti e-solder.
Ngaphezu kwamasu okuhlola okubukwayo, abanye abakhiqizi bangase benze ukuhlaziywa kwesigaba esiphambene, lapho isampula ye-solder joint isikwa futhi ihlolwe ngaphansi kwe-microscope. Lokhu kuhlaziya kunikeza ulwazi olubalulekile mayelana nekhwalithi ye-solder joint, njengokumanzisa i-solder, ukwakheka kwe-void, noma ukuba khona kwama-intermetallic compounds.
I-BGA soldering iveza izinselelo eziyingqayizivele ekwenziweni kwe-electronics, ngokuyinhloko ehlobene nezici ezihlukahlukene. Ngokubhekana nalezi zinselele ngokuphumelelayo, abakhiqizi bangaqinisekisa ukwethembeka nokusebenza kwamalunga e-BGA solder, okunomthelela ekukhiqizeni amadivaysi e-electronic aphezulu.
