Ngokusebenzisa umhlangano we-PCB wembobo ukusebenzisa ubuchwepheshe be-reflow soldering ukuhlanganisa izingxenye zembobo kanye nezingxenye ezimise okukhethekile. Njengoba namuhla imikhiqizo ikhokha kakhulu ukunakwa kwe-miniaturization, ukusebenza okwandayo kanye nokukhula kwezakhi, amaphaneli amaningi anohlangothi olulodwa nahlangothi olukabili ayizici ezibekwe phezulu.
Isihluthulelo sokusebenzisa amadivaysi e- through-hole kumabhodi wesekethe anezingxenye ezifakwe phezulu yikhono lokuhlinzeka ngesikhathi esisodwa sokuphinda kufakwe i-solder yezingxenye ze- through-hole kanye ne-surface-mount ngenqubo eyodwa ehlanganisiwe.
Uma kuqhathaniswa nenqubo evamile yokukhweza ngaphezulu, inani le-solder paste elisetshenziswa ku-PCBngokusebenzisa umhlangano wembobo kungaphezu kwalokho kwe-SMT ejwayelekile, okuyizikhathi ezingaba ngu-30. Njengamanje, umhlangano we-PCB wembobo ngokuyinhloko usebenzisa ubuchwepheshe obubili bokunamathisela be-solder, okuhlanganisa ukuphrinta kokunamathisela kwe-solder kanye nokukhipha okuzenzakalelayo kwe-solder paste.