Ibhodi le-SinkPAD (i-SinkPAD PCB) iwuhlobo olukhethekile lwe-PCB ewumgogodla wensimbi, i-thermal conductive PAD iyindawo eguquguqukayo ye-copper core / pedestal, ukuze i-PAD eshisayo ye-LED ithinte indawo yokuguquguquka komgogodla wensimbi ngqo, bese kuba ukushisa. ye-LED izosatshalaliswa emoyeni ngokushesha okukhulu nangempumelelo kune-MCPCB evamile, ukuze ukwazi ukuthola ukusebenza okushisayo okuphakeme kuma-LED amandla aphakathi nendawo ukuya phezulu, noma amanye ama-chips/izingxenye.
I-Copper iyinto esetshenziswa kakhulu eluhlaza esetshenziselwa i-SinkPAD metal core, njengoba i-thermal conductivity ingu-400W/m.K, ngakho-ke ngokuvamile abantu baphinde bayiqamba ngokuthi “i-SinkPAD copper core board”, noma “SinkPAD copper core PCB”. Nakuba i-thermal conductivity ye-Metal Core PCB yendabuko ingu-1-5W/m.K kuphela, njengoba inani likhawulelwe kusendlalelo se-dielectronic phakathi kwe-copper trace ne-metal core.
I-SinkPad ihlinzeka ngokudluliswa kokushisa okuhle kakhulu kusuka ku-LED kuya ku-metal base plate/pedestal, kuyilapho igcina ukuhlukaniswa okuhle kukagesi. Isisekelo sethusi sesisekelo sinikeza i-substrate yebhodi ubuqotho bokusebenza, futhi isabalalisa futhi idlulisele ukushisa kusinki yokushisa, indawo yokukhweza noma ngokuqondile emoyeni ozungezile.
Njengoba ungqimba lomkhondo we-elekthronikhi lwalusendaweni yokucwila yomgogodla wethusi, ngakho-ke saqamba lolo hlobo lwebhodi ngokuthi “SinkPAD Board (SinkPAD PCB)”, futhi ngenxa yokuthi ezimweni eziningi, i-core core iyithusi, ngakho-ke iphinde yaqanjwa ngokuthi “ I-SinkPAD copper core PCB”, noma “ibhodi lethusi le-SinkPAD”.