Siyazi, i-BGA soldering efanele iyiphuzu elibalulekile kunqubo ye-SMT, ukuqonda kangcono kanye nokuhlanganisa i-BGA, ukwazi izinselele nobunzima bayo kubalulekile. Nansi inselele enkulu ye-BGA soldering - ukuphathwa okushisayo
I-Ball Grid Array (BGA) ubuchwepheshe bokupakisha obuthuthukisiwe obusetshenziswa kakhulu embonini yezogesi. Iguqule indlela amasekethe ahlanganisiwe (ICs) afakwa ngayo kumabhodi esekethe aphrintiwe (PCBs). I-BGA inikeza izinzuzo eziningi kunezindlela zokupakisha ezivamile, okuyenza ibe ukukhetha okudumile kokusebenza okuphezulu kanye nezisetshenziswa zikagesi ezihlangene.
Ngenxa yamaphakheji e-BGA anobuningi bephinikhodi futhi ngokuvamile aqukethe izingxenye ezilambele amandla, okuholela ekukhiqizeni ukushisa okukhulu. Ukushabalaliswa okuphumelelayo kwalokhu kushisa kubalulekile ukuze kuvinjwe ukushisa futhi kuqinisekiswe impilo ende nokusebenza kwensiza kagesi. Ukuhlelwa okuminyene kwamabhola e-solder kanye nesikhala esilinganiselwe phakathi kwawo kwenza kube inselele ukuqeda ukushisa ngempumelelo.
Ngakho-ke klama ukuphathwa okushisayo okufanele kwama-chips akho e-BGA kubalulekile ngokusobala.
Vele ushiye i-imeyili yakho noma inombolo yocingo efomini lokuxhumana ukuze sikuthumelele i-quote yamahhala yohlu lwethu olubanzi lwemiklamo!